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SAP C-TS420-1709 Exam Syllabus Topics:

SAP Certified Application Associate - SAP S/4HANA Production Planning and Manufacturing (1709) Sample Questions:

1. The pegging situation was changed because of an MRP heuristic run. What is a capability of dynamic
pegging?
Response:

A) It propagates changed sales order priorities to the pegged planned orders
B) It enables the propagation of network alerts across the bill of materials structure
C) It links receipts from an alternative location in case of a shortage in the default location
D) It replaces fixed pegging relationships unless they have been created for stock

2. Which technological advances enabled the development of SAP S/4HANA as the digital core?
There are 3 correct answers to this question.
Response:

A) Advances in the three-tier architecture approach
B) Multi core processors enabling parallelism of tasks
C) Capability to add to server landscape and scale
D) Wide adoption of web standards such as Service oriented architecture
E) Big and affordable memory

3. In Make-to-order production, which field controls whether the components will be planned as sales
order specific stock?
Please choose the correct answer.
Response:

A) The MRP Type of the component
B) The item category of the component in the BOM
C) The Individual/Collective indicator of the component
D) The Planning Strategy of the finished product

4. Which data model changes have been implemented in Sales and Distribution?
There are 3 correct answers to this question.
Response:

A) Elimination of customer master tables
B) Elimination of output condition tables
C) Elimination of status tables
D) Elimination of LIS tables for rebates
E) Elimination of document index tables

5. How can you limit the number of master data objects to be created when the manufacturing process is
the same for many different products?
Please choose the correct answer.
Response:

A) By creating routings with alternative sequences
B) By assigning different materials to the same routing
C) By assigning the same production version to different materials
D) By creating routings with parallel sequences

Solutions: